A back-illuminated sensor, also known as backside illumination (BI) sensor, is a type of digital image sensor that uses a novel arrangement of the imaging elements to increase the amount of light captured and thereby improve low-light performance.
Side by Side Breakdown: iPhone 4 vs. EVO 4G
A back-illuminated sensor contains the same elements, but arranges the wiring behind the photocathode layer by flipping the silicon wafer during manufacturing and then thinning its reverse side so that light can strike the photocathode layer without passing through the wiring layer.[7] This change can improve the chance of an input photon being captured from about 60% to over 90%,[8] (i.e. a 1/2 stop faster) with the greatest difference realised when pixel size is small,[citation needed] as the light capture area gained in moving the wiring from the top (light incident) to bottom surface (paraphrasing the BSI design) is proportionately smaller for a larger pixel.[citation needed] BSI-CMOS sensors are most advantageous in partial sun and other low light conditions.[9] Placing the wiring behind the light sensors is similar to the difference between a cephalopod eye and a vertebrate eye. Orienting the active matrix transistors behind the photocathode layer can lead to a host of problems, such as crosstalk, which causes image noise, dark current, and color mixing between adjacent pixels. Thinning also makes the silicon wafer more fragile. These problems could be solved through improved manufacturing processes, but only at the cost of lower yields, and consequently higher prices. Despite these issues, early BI sensors found uses in niche roles where their better low-light performance was important. Early uses included industrial sensors, security cameras, microscope cameras and astronomy systems.[8]
In January 2012, Sony developed the back-side illuminated sensor further with Stacked CMOS,[3] where the supporting circuitry is moved below the active pixel section, giving another 30% improvement to light capturing capability.[17] This was commercialized by Sony in August 2012 as Exmor RS with resolutions of 13 and 8 effective megapixels.[18]
Replacing this component requires intricacy and caution with moving internal parts and circuitry inside the phone to avoid further damage to the other functionalities. Proceed with caution using a soldering iron used to detach the charging port.
Abbreviated variously as the "O11 Dynamic EVO" or "O11D EVO," Lian Li's new-for-'22 O11 Dynamic Evolution ($170) desktop PC case is such a radical evolution of the popular O11 showcase chassis of a decade ago that it's hard to call it the same case. A flexible design that allows users to flip the top and bottom panels for upside-down or traditional orientation is just the beginning of the options this unique chassis supports. It's a fine pick if you're looking for maximum visibility for your system innards; modest builds may want a model that allows for more cover-up. It will tax your system-planning and cable-routing skills to the max.
Words like left and right start to lose their meaning when you're talking about a PC case that can be flipped, but there's still a show side and a go side. The former is tempered glass in a tint that matches the face, while the plain side is colored in your choice of anodized black, painted white, or Harbor Gray "tinted brushed aluminum," which, according to both our eyes and our meters, is actually just painted. You won't see any brushed texture that might exist under the paint of the gray model we tested.
The metal side is vented in a way that hints at the O11D EVO's internal cooling configuration. The chassis frame has three 120mm radiator mounts, on the top, bottom, and side, with the last well-aligned with the metal panel's forward vent holes. In case you're wondering, that extra row of fan mounts does allow you to opt for a configuration with two 140mm fans as an alternative.
Rather than have the motherboard tray folded inward in front of the board, as in many other chassis, the O11D EVO's side-by-side compartments make room for the fold to go toward the power supply compartment instead. Two large cable passages face the rear of the power supply, obliging you to wrap cables around the tray to reach the motherboard's main power connection and the supplemental power headers of graphics cards, but the design also keeps those cables out of the way of the side radiator mount. A hard drive bracket between the side radiator and power supply bracket is designed to clear the inward edges of longer power supply bodies.
Now, if you prefer your motherboard to face right instead of left, the bottom panel can be removed and swapped with the top panel. One gripe is that the bottom panel's dust filter is the only one in the system and, being held in place with magnetic strips at its edges, is prone to falling off during handling. In this area, you'll also note additional square holes near two corners that allow the front-panel module to be relocated to either side.
As you can see above, the O11D EVO comes with a metric ton of accessories and options. You get brackets for installing drives on the bottom and side radiator mounts, a thick rubber spacer block to support a second power supply against the first, and a thinner rubber sheet to prevent vibration between the lower power supply and side support bracket.
Lian Li says the O11D EVO supports Extended ATX (EATX) motherboards up to 11 inches deep, but the full spec for EATX is 13 inches, and motherboards that fall between that size and ATX get labeled in a confusing manner. Our build shows there's plenty of room for motherboards of nearly any depth as long as the radiator mount on the side is left empty. Of course, using that mount is key to making this case look spectacular.
Besides illustrating how our lighted components look through the O11D EVO's tempered glass, our finished system photo shows just how much light can get through its side-panel vents. That could create a grand visual for builders willing to put RGB fans on both sides of their radiators as well as those installing a single layer of fans without the radiator.
The glass side of the O11D EVO is slightly quieter than the Cooler Master's, while the vented side is slightly noisier. Both fall within earshot of the quiet-design Seta Q1, while the Corsair gets penalized for having more powerful fans than either the HAF 500 or Seta Q1.
Still, we'd suggest you ideally add fans to the bottom mount, the side mount, or both. The Lian Li is, after all, designed to hold up to three large radiators. And because of the extreme glass visibility, it practically begs for LED fans galore, whether mounted straight on the case or on radiators.
That leaves us feeling a bit mixed about the side mount, however, because as great as it looks if you were to put an RGB-lit cooler or fan set there, using it will likely create a dust problem. Even those who choose to mount their own filter internally between the side panel and radiator bracket may notice dust collecting around the vent holes in short order. And while using it in exhaust orientation is another option, having six exhaust fans and only three intakes will cause the system to draw dust in through all of the case's other openings. Then again, most of those are on the back, and creative PC builders could figure out a filtration scheme for them.
Overall, maybe we're overthinking it. The O11D EVO's prime customers are show-system builders who regularly blow their PCs out with compressed air. You could possibly boost the case's practicality by using higher-flow fans on the bottom or ignoring the side radiator mount, but, after all, we're looking at a case that can support more drives than most people own. For builders who use the side drive mount instead of radiators, this chassis could be the best of both "show-off" and "storage."
The display and menu were adapted to the new system implementing a new iDrive interface (ID8). It consists of 4 widgets arranged on the left side of the screen (Menu, Media, Tel, Nav) with the central portion of the screen being fully configurable by drag and drop widgets. The interface is designed mostly for voice, touch and gesture operation.
All of the connections, except for the permanently attached power cable that extends from the bottom center, sit on the left side of the enclosure and face left. They include four HDMI ports (one eARC), three USB ports, an Ethernet port, an optical audio input, an antenna/cable connector, and 3.5mm ports for RS-232C control and an IR blaster. The permanently attached power cable is a disappointment, as cables are very vulnerable to damage and we always prefer the ability to easily replace them (or to simply use a longer or shorter cable as needed).
If you have to work client-side, utilize the 2-in-1 function to convert your Yoga into a tablet. With the integral Stylus pen, let it recreate the feeling of sketching your ideas onto paper as you stand side-by-side with your client. Then instantly email them copies with the Yoga's super connectivity and touchscreen display.
The left side of the phone only has the Micro-USB port, while the top houses the 3.5mm headphone jack and the power/lock button. The bottom of the EVO 3D seems no action with only notch to pry open the back cover.
The flip side of the EVO 3D is a bit different from your regular HTC phones. For starters, since this is not an aluminum unibody design, the whole back cover is made of removable high-quality plastic. I can see why HTC went with a plastic material on the high end device. A traditional metallic back would only have added to the already heavy weight of they phone. The back cover has a textured pattern though and it looks really nice.
3D Video is recorded in side-by-side mode: which lowers the effective horizontal resolution into half. Videos are still recorded in MP4 format with 30 frames per second and still retain a good amount of detail for 3D video. The rolling shutter effect comes into play when recording video, but I'm not holding it against the EVO 3D because I still haven't used a smartphone that doesn't suffer from this issue. 2ff7e9595c
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